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Title:
TRANSPARENT MOLDED RESIN ARTICLE AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2011052063
Kind Code:
A
Abstract:

To provide a transparent molded resin article which has high heat resistance capable of being used for solder reflow using a lead-free solder and high transparency enabling to be used as optical members, and can easily be produced, and to provide a method for producing the same.

There are provided the transparent molded resin article, the molded article of a resin composition comprising a fluorine resin, characterized in that the resin composition is cross-linked by the irradiation of ionizing radiations once or more in a temperature atmosphere at a temperature below the melting point of the fluorine resin and by the irradiation of ionizing radiations once or more in a temperature atmosphere at a temperature above the melting point of the fluorine resin, and the method for producing the same.


Inventors:
YAMAZAKI SATOSHI
HAYAMI HIROSHI
NAKABAYASHI MAKOTO
Application Number:
JP2009200324A
Publication Date:
March 17, 2011
Filing Date:
August 31, 2009
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
SUMITOMO ELEC FINE POLYMER INC
International Classes:
C08J7/00; C08K5/103; C08L23/04; C08L27/18; C08L27/20; G02B1/04
Domestic Patent References:
JP2002327067A2002-11-15
JP2002293953A2002-10-09
JP2002327067A2002-11-15
Attorney, Agent or Firm:
Tetsuji Kamidai
Naomi Kamino