Title:
透明超音波センサー及びその製造方法
Document Type and Number:
Japanese Patent JP7400086
Kind Code:
B2
Abstract:
Disclosed herein is a transparent ultrasonic sensor including a matching unit configured to perform optical impedance matching and formed of a transparent material, a piezoelectric layer positioned behind the matching unit and formed of a transparent material, a first electrode layer and a second electrode layer positioned on a rear surface and a front surface of the piezoelectric layer, respectively, the first electrode layer and the second electrode layer being formed of a transparent conductive material, a first housing connected to the first electrode layer, and a second housing connected to the second electrode layer.
Inventors:
Kim Chul-heon
Kim Hyun-ham
Park Byul-ri
Park Jung Woo
Kim Hyun-ham
Park Byul-ri
Park Jung Woo
Application Number:
JP2022517355A
Publication Date:
December 18, 2023
Filing Date:
April 09, 2020
Export Citation:
Assignee:
POSTECH ACADEMY-INDUSTRY FOUNDATION
International Classes:
H04R17/00; H04R1/34; H04R31/00
Domestic Patent References:
| JP2005021380A | ||||
| JP2013188465A | ||||
| JP2007136210A | ||||
| JP2004057806A | ||||
| JP2016521999A |
Attorney, Agent or Firm:
Kenzo Matsuura