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Title:
SHIPPING BAG FOR SILICON MATERIAL AND PACKAGE BODY FOR SILICON MATERIAL
Document Type and Number:
Japanese Patent JP2022122294
Kind Code:
A
Abstract:
To provide a shipping bag for silicon material and a package body for the silicon material allowing contamination of the content of the silicon material to be suppressed even in a case where an outer bag is damaged during shipping.SOLUTION: A shipping bag for silicon material is provided with a first bag and a second bag placed in the first bag, wherein package material configuring the second bag includes a barrier layer.SELECTED DRAWING: Figure 1

More Like This:
WO/2014/066467BAG IN A BOX ASSEMBLY
WO/2012/085939PALLET CONTAINER WITH IMPROVED PLASTICS PALLET
Inventors:
TACHIKAWA YUKA
MOTAI KATSUYUKI
NAKAJIMA HIROYOSHI
Application Number:
JP2019159111A
Publication Date:
August 23, 2022
Filing Date:
August 30, 2019
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B65D77/04; B65D30/02
Domestic Patent References:
JP2009202927A2009-09-10
JP2012223942A2012-11-15
JP2010195425A2010-09-09
JP2003318254A2003-11-07
JP2002274594A2002-09-25
Attorney, Agent or Firm:
Masataka Ota



 
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