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Title:
TREATMENT DEVICE OF SUBSTRATE AND TREATMENT LIQUID EJECTOR
Document Type and Number:
Japanese Patent JP3916491
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a treatment device arranged to eject treatment liquid uniformly from a plurality of nozzles toward a substrate.
SOLUTION: The system for treating the surface of a substrate carried in a specified direction by ejecting treatment liquid comprises a branch supply pipe 13 of treatment liquid, a shower pipe 16 arranged such that the axis thereof extends along a direction intersecting the carrying direction of substrate and provided with a plurality of nozzles 18 for ejecting the treatment liquid toward the surface of the substrate at a specified interval in the axial direction, and a chamber 15 provided integrally with the shower pipe and temporarily storing the treatment liquid supplied from the supply pipe before being supplied to the shower pipe.


Inventors:
Hiroko Ishikawa
Akinori Iso
Application Number:
JP2002093315A
Publication Date:
May 16, 2007
Filing Date:
March 28, 2002
Export Citation:
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Assignee:
Shibaura Mechatronics Co., Ltd.
International Classes:
G03F7/40; H01L21/306; G03F7/42; H01L21/027; H01L21/304; (IPC1-7): H01L21/306; G03F7/40; G03F7/42; H01L21/027
Domestic Patent References:
JP3061330U
JP49104436A
JP52092533U
JP54030038U
JP55119162U
JP55020612A
JP3016666A
Attorney, Agent or Firm:
Takehiko Suzue
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Shoji Kawai