PURPOSE: To provide a treating method which enables effectively removing halogens and halogen compounds in an exhaust gas from the dry etching stage in the semiconductor manufacturing process.
CONSTITUTION: A container of 400mm diameter made of acrylic resin is packed with a silicate having 7 to 16 mesh particle size and 9 average pore diameter, up to the 50mm height. Then, N2 gas contg. SiF4, F2, HCl, Cl2, HBr, Br2 and CCl4, in 1% concentration each, is supplied through the silicate at the rate of 0.3 liter/min. Each of the above halogen and halogen compound gases breaks through the silicate when the gas volume fed per 1 liter of the silicate amounts to 19, 60, 47, 20, 53, 31 and 12 liters, respectively. Therefore, a zeolite having 9 average pore diameter is capable of adsorbing halogen and halogen compound gases without exception.
MORI YOICHI
KYOTANI TAKASHI
EBARA RES CO LTD
EBARA CORP
JPS61153190A | 1986-07-11 | |||
JPS63291624A | 1988-11-29 |