Title:
半導体集積回路のトリミング方法
Document Type and Number:
Japanese Patent JP3571926
Kind Code:
B2
Inventors:
Kazuo Noda
Naoki Fukunaga
Hirohisa Warita
Naoki Fukunaga
Hirohisa Warita
Application Number:
JP23776298A
Publication Date:
September 29, 2004
Filing Date:
August 24, 1998
Export Citation:
Assignee:
Sharp Corporation
International Classes:
G01R27/02; G05F3/26; H01L21/822; H01L27/04; (IPC1-7): H01L21/822; H01L27/04
Domestic Patent References:
| JP6026314U | ||||
| JP3092056U | ||||
| JP3045657U | ||||
| JP7202122A |
Attorney, Agent or Firm:
Keiichiro Saikyo