Title:
ツルーイング方法及び面取り装置
Document Type and Number:
Japanese Patent JP7234317
Kind Code:
B2
Abstract:
To improve a transfer rate and the processability of truing, and to improve the accuracy of a groove formed at a truer.SOLUTION: In a truing method for forming a groove of a grinding stone 55 for grinding a chamfer part of a wafer W by using a disc-shaped truer 41, a plane surface of the truer 41 which is thinned in a thickness more than a width of the groove is fixed in the thickness direction by a table 34 which is smaller than an external peripheral shape of the truer 41, an upper part or a lower part in a scheduled position of the groove in which the truer 41 is formed at the grinding stone 55 is processed by the truer 41, and after that, the truer 41 is processed by being relatively descended or ascended to the thickness direction with respect to the grinding stone 55.SELECTED DRAWING: Figure 6
Inventors:
Shinichi Kishishita
Yuki Ishii
Yuki Ishii
Application Number:
JP2021147470A
Publication Date:
March 07, 2023
Filing Date:
September 10, 2021
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B24B53/07; B24B9/00; H01L21/304
Domestic Patent References:
| JP2018167331A | ||||
| JP2005153085A | ||||
| JP2007061978A | ||||
| JP2008302466A | ||||
| JP6114731A | ||||
| JP62173170A |
Foreign References:
| CN103802039A |
Attorney, Agent or Firm:
Yoshinobu Kanayama