Title:
均一な組織を有するタングステン-銅合金及びその製造方法
Document Type and Number:
Japanese Patent JP4146333
Kind Code:
B2
Abstract:
The fabrication of a tungsten-copper alloy with a homogenous microstructure involves: (a) forming a powdered mixture from tungsten powder and composite W-Cu composite powder; (b) forming a compact by forming under pressure of the powdered mixture; (c) forming a skeleton by sintering the compact; (d) putting the copper in contact with the skeleton and effecting infiltration. An Independent claim is also included for a tungsten-copper alloy with a homogenous microstructure produced as above.
Inventors:
Hong Moon-Hee
Choi Ja-ho
Lee Sung
Kim Yoon-Pyo
Lee Sun-ho
Know John-Woon
Choi Ja-ho
Lee Sung
Kim Yoon-Pyo
Lee Sun-ho
Know John-Woon
Application Number:
JP2003402079A
Publication Date:
September 10, 2008
Filing Date:
December 01, 2003
Export Citation:
Assignee:
National Defense Research Institute
International Classes:
B22F3/00; C22C1/04; B22F1/02; B22F3/10; B22F3/26; C22C27/04; H01H1/025
Domestic Patent References:
| JP44019016B1 | ||||
| JP4049642A | ||||
| JP3120324A |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Masaya Nishiyama
Takashi Ishida
Tetsuji Koga
Masaya Nishiyama