Two ingredients of room temperature shock resistance structure adhesives

Japanese Patent JP5916634

B2

Two-component epoxy resin composition comprises: an epoxy resin component (K1) comprising at least one epoxy resin (A) with an average of more than one epoxide group per molecule; and a curing component (K2) comprising an amino group terminated polyamide (B) (1-10 wt.%, preferably 4-8 wt.%, based on the total weight of the curing component). At least one of the components (K1) and (K2) comprises at least one impact strength modifier (c). Independent claims are also included for: (1) bonding a substrate, comprising (a) mixing the above two-component epoxy resin composition, (b) applying the composition on the surface of a substrate, preferably a metal, (c) contacting the applied epoxy resin composition with the surface of another substrate, preferably a metal, and (d) curing the epoxy resin composition at = 140[deg] C, preferably 10-60[deg] C; and (2) a bonded article, which is obtained by the above method, preferably a vehicle or a mounted part of a vehicle.

JPH03237127

POLYEPOXIDE-BASED CURABLE COMPOSITION

Karlsten Flick
Jürgen Finter
Andreas Crammer
Ulrich Gerber

JP2012555391A

May 11, 2016

March 01, 2011

Click for automatic bibliography generation  

Seeker Technology AG

C08G59/54; C08G18/10; C08G18/40; C09J11/04; C09J11/08; C09J109/02; C09J163/00; C09J175/04; C09J177/00; C09J179/02

JP60124682A
JP2006131787A
JP50129633A
JP62179524A
JP6184512A
JP2006089658A

WO2009025991A1
WO2008049857A1

Yasuhiko Murayama
Masatake Shiga
Takashi Watanabe
Shinya Mitsuhiro

Previous Patent: A manufacturing method of conductive paste and an electric conduction film

Next Patent: PRESS MACHINE PROVIDED WITH ROBOT