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Patent Searching and Data


Title:
TWO-PACK CONDUCTIVE RESIN COMPOSITION FOR FLOOR COATING, FLOORING MATERIAL AND WORKING METHOD USING THE FLOORING MATERIAL
Document Type and Number:
Japanese Patent JP2009235317
Kind Code:
A
Abstract:

To provide a two-pack conductive resin composition for floor coating, which is provided with a sufficient working life and excellent coating workability, and with which the floor is coated by hands, and further a hard floor with high hardness is obtained, and with which conductive smooth floor coating without unevenness is imparted, and to provide a flooring material and a working method using the flooring material.

The two-pack conductive resin composition for floor coating, which is characterized in that it includes a polyol compound (A) comprising a liquid polyol comprising a bisphenol-based polyol (a-1) and a natural oil aliphatic acid or its derivative (a-2), active alumina powder (a-3), and an ionic compound containing polyol solution (a-4), and a polyisocyanate compound (B), wherein a -O-C-C-O- structure originating from (a-1) and/or (a-4) of 0.04-1 mol/kg is contained therein with respect to the total quantity of (A) and (B), is provided.


Inventors:
NONAKA SHINICHI
TAKIGAWA YUKO
Application Number:
JP2008086279A
Publication Date:
October 15, 2009
Filing Date:
March 28, 2008
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
C09D175/04; C09D4/00; C09D5/24; C09D7/12; C09D175/08; H01B1/20
Attorney, Agent or Firm:
Kono Tsuyo