Title:
ULTRA-HIGH PRESSURE-SINTERED-MATERIAL CUTTING TOOL EXCELLENT IN HARD PHASE ADHESION
Document Type and Number:
Japanese Patent JPH04300105
Kind Code:
A
Abstract:
PURPOSE: To increase wear resistance of an ultra-high pressure-sintered-material cutting tool comprising a diamond hard phase, c-BN hard phase, and Co-system bonding phase.
CONSTITUTION: A cutting tool is made of a material sintered at an ultra-high pressure with a composition in capacity % of bonding phase composed mainly of Co and inevitable impurities of 5 to 50%, diamond hard phase coated with deposition layer of c-BN with a mean layer thickness of 0. 01 to 5μm of 10 to 60%, and a hard phase of C-BN of 10 to 60% and is excellent in hard phase adhesion.
Inventors:
TANASE TERUYOSHI
NAKANO KOICHI
YAMAMOTO KAZUO
NAKANO KOICHI
YAMAMOTO KAZUO
Application Number:
JP8973591A
Publication Date:
October 23, 1992
Filing Date:
March 28, 1991
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B23B27/14; C22C26/00; C22C29/16; (IPC1-7): B23B27/14; C22C26/00; C22C29/16
Attorney, Agent or Firm:
Kazuo Tomita (1 person outside)
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