Title:
超音波トランスデューサアセンブリ及び超音波トランスデューサアセンブリを製造するための方法
Document Type and Number:
Japanese Patent JP6530403
Kind Code:
B2
Abstract:
The present invention relates to an ultrasound transducer assembly (10), in particular for intra vascular ultrasound systems. The assembly (10) comprises a transducer array (12) including a plurality of transducer elements (14) for transmitting and receiving ultrasound waves. Two support elements (16, 18) are provided for supporting the transducer array (12) in a curved or polygonal shape. The support elements (16, 18) are connected via a flexible connection layer (20) to the transducer array (12) for flexibly connecting the support elements (16, 18) to the transducer array (12).
Inventors:
Decker, Ronald
Henneken, Vincent Adrianis
Henneken, Vincent Adrianis
Application Number:
JP2016537211A
Publication Date:
June 12, 2019
Filing Date:
August 14, 2014
Export Citation:
Assignee:
KONINKLIJKE PHILIPS N.V.
International Classes:
H04R17/00; A61B8/12; H04R31/00
Domestic Patent References:
| JP2011505205A | ||||
| JP10192281A | ||||
| JP2009207575A |
Foreign References:
| US20130146995 | ||||
| US20070264732 | ||||
| US20100280388 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Shinsuke Onuki
Tadahiko Ito
Shinsuke Onuki