Title:
超音波接合装置
Document Type and Number:
Japanese Patent JP6882757
Kind Code:
B2
Abstract:
An ultrasonic joining device (1) performs ultrasonic joining by lowering a horn (9) by an elevator (5), sandwiching two aluminum alloy plates (W1) between an anvil (3) and a tip (10), and vibrating the horn (9) by a vibration unit (7). A slide member (11) slidable in the vertical direction is provided on the inside of the tip (10). A coil spring (12) presses downward on the slide member (11) to make the slide member slide downward so that the lower part thereof springs from the lower portion of the tip (10).
Inventors:
Toshimasa Yamane
Uehara Issei
Uehara Issei
Application Number:
JP2016226711A
Publication Date:
June 02, 2021
Filing Date:
November 22, 2016
Export Citation:
Assignee:
Key Rex Co., Ltd.
International Classes:
B23K20/10
Domestic Patent References:
| JP201760963A | ||||
| JP857959A | ||||
| JP63272612A | ||||
| JP5778720A | ||||
| JP2010274296A | ||||
| JP9108855A |
Attorney, Agent or Firm:
Maeda patent office