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Title:
ULTRASONIC FLAW DETECTING APPARATUS AND ULTRASONIC FLAW DETECTING METHOD
Document Type and Number:
Japanese Patent JP2011203037
Kind Code:
A
Abstract:

To provide an ultrasonic flaw detecting technology capable of accurately and speedily detecting a flaw which exists at a bottom surface or near a corner of a test object.

The ultrasonic flaw detecting apparatus includes a transducer 2 consisting of an array of two or more piezoelectric elements 25 for transmitting ultrasonic waves to and receiving echo signals U from a test object 3, an element driving unit 11 for scanning the two or more piezoelectric elements 25 at a predetermined cycle and transmitting the ultrasonic waves, a synthesizing unit 15 for synthesizing an internal image of the test object 3 based on the echo signals U received respectively by the two or more piezoelectric elements 25, and a signal replacing unit 17 for replacing the received echo signal U with an echo signal in which echoes at a bottom surface 3b of the test object 3 are removed.


Inventors:
ITO YOSHINO
KARASAWA HIROICHI
YADOGUCHI TETSUYA
KOKUBO KOICHI
KAWAKAMI TETSUO
UEDA YOSHIHISA
HIEDA TAKESHI
ISOBE HIDEO
HARUNA KAZUYUKI
NIKI MASAMITSU
Application Number:
JP2010069348A
Publication Date:
October 13, 2011
Filing Date:
March 25, 2010
Export Citation:
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Assignee:
TOSHIBA CORP
SUMITOMO METAL IND
TOSHIBA PLANT SYSTEMS & SERVICES CORP
SUMITOMO KINZOKU TECHNOL KK
International Classes:
G01N29/44; G01N29/04; G01N29/26
Domestic Patent References:
JP2005106782A2005-04-21
JP2006162321A2006-06-22
JP2003299066A2003-10-17
JP2001269341A2001-10-02
JPH02213330A1990-08-24
JPH03248058A1991-11-06
JP2005156305A2005-06-16
JP9041313A
JP2006250873A2006-09-21
Other References:
JPN6012010483; 新井良一,外: '大型3D超音波探傷システム' 東芝レビュー 第62巻,第8号, 20070801, P.57-61
Attorney, Agent or Firm:
Hisashi Hatano
Shunguchi Sekiguchi
Akio Saruwatari
Osamu Kawamura
Jun Matsunaga