To provide an ultrasonic flaw detecting technology capable of accurately and speedily detecting a flaw which exists at a bottom surface or near a corner of a test object.
The ultrasonic flaw detecting apparatus includes a transducer 2 consisting of an array of two or more piezoelectric elements 25 for transmitting ultrasonic waves to and receiving echo signals U from a test object 3, an element driving unit 11 for scanning the two or more piezoelectric elements 25 at a predetermined cycle and transmitting the ultrasonic waves, a synthesizing unit 15 for synthesizing an internal image of the test object 3 based on the echo signals U received respectively by the two or more piezoelectric elements 25, and a signal replacing unit 17 for replacing the received echo signal U with an echo signal in which echoes at a bottom surface 3b of the test object 3 are removed.
KARASAWA HIROICHI
YADOGUCHI TETSUYA
KOKUBO KOICHI
KAWAKAMI TETSUO
UEDA YOSHIHISA
HIEDA TAKESHI
ISOBE HIDEO
HARUNA KAZUYUKI
NIKI MASAMITSU
SUMITOMO METAL IND
TOSHIBA PLANT SYSTEMS & SERVICES CORP
SUMITOMO KINZOKU TECHNOL KK
JP2005106782A | 2005-04-21 | |||
JP2006162321A | 2006-06-22 | |||
JP2003299066A | 2003-10-17 | |||
JP2001269341A | 2001-10-02 | |||
JPH02213330A | 1990-08-24 | |||
JPH03248058A | 1991-11-06 | |||
JP2005156305A | 2005-06-16 | |||
JP9041313A | ||||
JP2006250873A | 2006-09-21 |
Shunguchi Sekiguchi
Akio Saruwatari
Osamu Kawamura
Jun Matsunaga
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