Title:
超音波探触子及びその製造方法
Document Type and Number:
Japanese Patent JP5836727
Kind Code:
B2
Abstract:
A manufacturing method of an ultrasonic probe that has a signal foil made of a copper foil patterned by an additive method is provided. The manufacturing method includes preparing a base material and forming an insulating layer on a surface of the material, patterning the insulating layer by exposure, development, and peeling according to a lithographic technique, forming a cavity reaching an upper surface of the base material in the insulating layer along the patterning, forming a signal foil by performing plating in the cavity in the order of copper plating and solder plating, and demolding the formed signal foil from the cavity.
Inventors:
Yasunobu Hasegawa
Application Number:
JP2011207200A
Publication Date:
December 24, 2015
Filing Date:
September 22, 2011
Export Citation:
Assignee:
Nippon Denpa Industry Co., Ltd.
International Classes:
H04R17/00; H04R31/00
Domestic Patent References:
| JP10126888A | ||||
| JP2003096593A | ||||
| JP60140153A | ||||
| JP56125199A | ||||
| JP4255198A |
Attorney, Agent or Firm:
Akira Okawa
Takashi Tanabe
Takashi Tanabe