Title:
ULTRASONIC PROBE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2017073662
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To prevent occurrence of an electric failure factor in an electrode layer formed on a surface of a backing in an ultrasonic probe including the backing having a built-in lead array with an attenuation material filler mixed.SOLUTION: A backing 22 includes a backing material 24 and a two-dimensional lead array 26. The backing material 24 includes a main body 28 and an upper ground layer 30. The main body 28 includes an attenuation material filler 36, but the upper ground layer 30 does not include the attenuation material filler. A plurality of electrode pads 44 are provided on the upper ground layer 30. An upper end surface of the two-dimensional lead array 26 is exposed from the upper ground layer 30, and connected to each electrode pad 46. The attenuation material filler 36 is pushed by the upper ground layer 30, thereby preventing occurrence of an electric failure factor caused by the attenuation material filler 36 in the electrode pad 46.SELECTED DRAWING: Figure 1
Inventors:
KATSURA HIDETSUGU
TAWARA YOSHIHIRO
TAWARA YOSHIHIRO
Application Number:
JP2015199441A
Publication Date:
April 13, 2017
Filing Date:
October 07, 2015
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H04R17/00; A61B8/00; H04R31/00
Attorney, Agent or Firm:
Patent Corporation yki International Patent Office