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Title:
ULTRASONIC PROBE
Document Type and Number:
Japanese Patent JP2016018835
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a piezoelectric thin film with excellent characteristics and a method for manufacturing the same.SOLUTION: An ultrasonic probe comprises an element chip. The element chip comprises a flexible film, a lower electrode provided on the flexible film, a piezoelectric film, and an upper electrode. The piezoelectric film has a film thickness of not less than 0.5 μm and not more than 20 μm, is composed of crystal grains having an average grain diameter of not less than 0.005 μm and not more than 0.2 μm, and does not have a layered discontinuous surface on the cross-sectional surface thereof. The piezoelectric film is also composed of a three-component system piezoelectric material represented by xPb(MgNb)O-yPbZrO-zPbTiO(x, y, abd z represent a molar ratio, and x+y+z=1), and includes a composition in a range of the following four points of A, B, C, and D in a three-component system composition diagram of this formula:A(x=0.05,y=0.40,z=0.55)B(x=0.05,y=0.60,z=0.35)C(x=0.25,y=0.30,z=0.45)D(x=0.25,y=0.50,z=0.25)SELECTED DRAWING: Figure 14

Inventors:
NISHIWAKI MANABU
Application Number:
JP2014139413A
Publication Date:
February 01, 2016
Filing Date:
July 07, 2014
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
H01L41/187; A61B8/00; G01N29/24; H01L41/09; H01L41/318; H04R17/00; H04R31/00
Attorney, Agent or Firm:
Masahiko Ueyanagi
Kazuaki Watanabe