Title:
超音波センサーの製造方法
Document Type and Number:
Japanese Patent JP7285590
Kind Code:
B2
Abstract:
Disclosed is a method of manufacturing ultrasonic sensors. The method includes forming a micropattern having concave and convex portions on an etchable substrate, filling a piezoelectric material in the concave portions of the micropattern, pressurizing the filled piezoelectric material, sintering the piezoelectric material to form preliminary piezoelectric bodies, re-sintering the preliminary piezoelectric bodies to form densely packed unit piezoelectric bodies, and forming electrode terminals at both ends of each of the unit piezoelectric bodies to produce a unit piezoelectric cell. The method enables the manufacture of high-quality ultrasonic sensors in high yield.
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Inventors:
Kim, Yong Kyu
Park, Kyung Ok
LEE,Seung Jin
Park, Kyung Ok
LEE,Seung Jin
Application Number:
JP2021534098A
Publication Date:
June 02, 2023
Filing Date:
January 22, 2019
Export Citation:
Assignee:
BTL Company Limited
International Classes:
H04R31/00
Domestic Patent References:
| JP11274592A | ||||
| JP2002012425A | ||||
| JP2017011144A | ||||
| JP2013191751A | ||||
| JP2006261656A |
Foreign References:
| KR101858731B1 | ||||
| KR101830209B1 | ||||
| US20180236489 |
Attorney, Agent or Firm:
Patent Attorney Corporation Sosei International Patent Office