Title:
ULTRASONIC TRANSDUCER FOR ENHANCING RESOLUTION OF IMAGING SYSTEM
Document Type and Number:
Japanese Patent JP3950755
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a simple and easy-to-machine matching layer material for extra wide bandwidth probe having an optimal acoustic impedance in ultrasonic imaging.
SOLUTION: In order to improve the resolution, the ultrasonic transducer employs a silicon acoustic matching layer (26) disposed inmost proximity to a piezoelectric layer (2). At the time of configuring a transducer, a silicon wafer polished into an appropriate thickness is included in an acoustic laminate together with other matching layer material (18, 20). Accurate thickness depends on the detail of design and the nominal thickness is equal to a quarter of wavelength in the case of silicon.
Inventors:
Lowell scott smith
Nim Haku Tea
Theodore Lauer Reine
Schwan-Min Lu
Nim Haku Tea
Theodore Lauer Reine
Schwan-Min Lu
Application Number:
JP2002196611A
Publication Date:
August 01, 2007
Filing Date:
July 05, 2002
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
H04R17/00; B06B1/06; G01N29/24; G01N29/28; G01S7/521; G03B42/06; G10K11/02; H01L41/08; H01L41/09; H01L41/187; H01L41/22; H01L41/313; A61B8/00; G01S7/52; (IPC1-7): H04R17/00; B06B1/06; H01L41/08; H01L41/09; H01L41/187; H01L41/22
Domestic Patent References:
| JP61170199A | ||||
| JP10322798A | ||||
| JP9065488A | ||||
| JP56163409U |
Attorney, Agent or Firm:
Kenichi Matsumoto
Hirokazu Ogura
Nobukazu Ito
Hirokazu Ogura
Nobukazu Ito