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Title:
ULTRAVIOLET-CURING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3677372
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a solvent-less ultraviolet-curing resin composition which can be uniformly applied without forming air bubbles so as to reach even the fine recessed parts on the finely irregular surface of a material, can be cured easily in a short time by ultraviolet irradiation, has excellent application properties, can give a cured film excellent in etching resistance, resistance to dissolution in an alkali and peeling resistance and is useful as a back coating agent in the production of etching protective materials, especially shadow masks.
SOLUTION: This composition contains a carboxylic photopolymerizable compound and has a surface tension of 30-50 mN/m at 25°C. It desirably comprises a compound having one carboxyl group and one acryloyl or methacryloyl group in the molecule, a compound having at least one acryloyl or methacryloyl group in the molecule, a leveling material and a photoinitiator.


Inventors:
Yasuhisa Otake
Masaru Nikaido
Shirako Hirahara
Kurabayashi Shigeaki
Nobuyuki Suzuki
Application Number:
JP13441397A
Publication Date:
July 27, 2005
Filing Date:
May 08, 1997
Export Citation:
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Assignee:
Toshiba Corporation
Taiyo Ink Manufacturing Co., Ltd.
International Classes:
G03F7/027; C08F2/48; C08F20/26; C08F220/26; C09D4/02; G03F7/028; H01J9/14; (IPC1-7): C08F220/26; C08F2/48; C09D4/02; H01J9/14
Domestic Patent References:
JP5098188A
JP5100423A
Attorney, Agent or Firm:
▲吉▼田 繁喜