To deposit a film of uniform film quality over the whole region a substrate face while maintaining the characteristics of high adhesion in an unbalanced magnetron sputtering (UBMS) process.
In the unbalanced magnetron sputtering (UBMS) system equipped with: an unbalanced magnetron sputtering electrode of forming a nonequilibrium magnetic field distribution; a rotary stage 1 provided with a holder 3 of holding a substrate 2; and a plurality of, preferably, three or more targets 4a, 4b, 4c provided around the rotary stage 1 and confronted with the surface of the substrate 2, (1) the plurality of, preferably, three or more targets 4a, 4b, 4c are installed in such a manner that their heights are changed, and also, a mechanism of rotating the stage 1 mounted with the substrate 2 is comprised, or (2) a mechanism of vibrating the substrate 2 to a parallel direction 5 to targets 4d, 4e, 4f (upper and lower directions to the rotary stage), and a mechanism of revolving the stage 1 mounted with the substrate 2 are comprised.
| JPH0741940A | 1995-02-10 | |||
| JP2000178739A | 2000-06-27 | |||
| JP2004010923A | 2004-01-15 | |||
| JP2004211135A | 2004-07-29 | |||
| JP2003293129A | 2003-10-15 |
Sekiya Mitsuo
Yasushi Hayakawa
Tsuruhiko Sekiguchi