Title:
Union device
Document Type and Number:
Japanese Patent JP6226880
Kind Code:
B2
Abstract:
Provided is a binding apparatus with which the quality of an object to be bound can be ensured and the burden on an operator can be reduced. A binding apparatus includes a pressure bonding mechanism in which pressure is applied by a pair of pressure bonding plates 34 and 35 to a joining portion of a binding tape 8, which is an adhesive tape, to fasten it together by gripping and squeezing a pair of levers 2 and 3 to rotate a pair of arms 4 and 5 around a fulcrum 6. Thereby, any mixing of metal staples into an object to be bound as in a conventional binding apparatus is eliminated, and thus the quality of the object to be bound can be ensured. Further, the need for a strong grip strength like that when ejecting a staple is eliminated, and thus the burden on an operator can be reduced.
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Inventors:
Masanori Sato
Hiromi Matsushita
Moriyama Eri
Hiromi Matsushita
Moriyama Eri
Application Number:
JP2014550195A
Publication Date:
November 08, 2017
Filing Date:
November 26, 2013
Export Citation:
Assignee:
Nichiban Co., Ltd.
International Classes:
B65B27/00; B65B13/24
Domestic Patent References:
| JP2008253194A | ||||
| JP2002284115A | ||||
| JP2010274937A |
Attorney, Agent or Firm:
Calyx
Miyazaki Yoshio
Akio Tagami
High Masahiro
Miyazaki Yoshio
Akio Tagami
High Masahiro
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