Title:
UNIT FOR WAFER BONDING
Document Type and Number:
Japanese Patent JPS6181474
Kind Code:
A
Abstract:
PURPOSE: A wafer is placed on a mounting plate through an adhesive, then the wafer is pressed stepwise from the center toward its periphery to equalize the thickness of the adhesive layer with high precision, further prevent the wafer from being scratched on its back surface.
CONSTITUTION: Wafer 2 is placed on a mounting plate 1 through an adhesive 3 and a press 9 contacting with the wafer 2 is pressed stepwise from the center of the wafer toward its periphery.
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Inventors:
KONUMA KOJI
UYAMA NAGATERU
UYAMA NAGATERU
Application Number:
JP20193084A
Publication Date:
April 25, 1986
Filing Date:
September 28, 1984
Export Citation:
Assignee:
TOSHIBA CERAMICS CO
International Classes:
H01L21/683; C09J5/00; H01L21/67; H01L21/68; (IPC1-7): C09J5/00; H01L21/68