Title:
5自由度を有するユニバーサルプロービングアセンブリ
Document Type and Number:
Japanese Patent JP7220148
Kind Code:
B2
Abstract:
A universal multi-pin, adjustable probing assembly or manipulator for use in parametric and reliability testing of devices on a semiconductor wafer. The probing assembly can be mounted and adjusted on a metal platen using a magnetic field. The strength of the magnetic field can be adjusted by a switchable magnetic slab to which a block is connected via an arm. A probe head can be attached to a side face of the block, which includes a tilt control mechanism for tilting the probe head to ensure that probe tips land simultaneously on pads of dies. The probe head also includes four adjusting mechanisms for translation in the X, Y, and Z directions, as well as rotation about the Z axis.
Inventors:
Rupashk Mirsha
Orlans Remy
Orlans Remy
Application Number:
JP2019531822A
Publication Date:
February 09, 2023
Filing Date:
December 19, 2017
Export Citation:
Assignee:
QUALITAU INCORPORATED
International Classes:
G01R31/28; G01R1/06; H01L21/66
Domestic Patent References:
JP2002942A | ||||
JP5266849A | ||||
JP2008122145A | ||||
JP6023250U | ||||
JP2000353844A |
Foreign References:
US20100301890 | ||||
US20160187377 | ||||
US20090049944 | ||||
US20100277195 |
Attorney, Agent or Firm:
Patent Attorney Corporation Meisei International Patent Office