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Title:
URETHANE HOT-MELT SEALING COMPOUND
Document Type and Number:
Japanese Patent JPS5670076
Kind Code:
A
Abstract:

PURPOSE: The titled moisture curing sealing compound, having a long open time and improved adhesiveness and heat resistance, and comprising a polymer prepared by reacting a thermoplastic polymer having a terminal hydroxyl group obtained through a specific reaction with a diisocyanate compound.

CONSTITUTION: The titled sealing compound comprising a polymer prepared by melting (A) 100pts.wt. urethane thermoplastic polymer having a terminal hydroxyl group, obtained by reacting (a) one or more types of rosin ester resin and terpene phenol resin with (b) a diisocyanate compound and then (c) a urethane prepolymer having terminal NCO groups (molecular weight : 3,500W6,000 and NCO content : 1.0W3.0wt%), with (B) 0W15pts.wt. phthalic ester plasticizer (C) 0W50pts.wt. inorganic filler and (D) 0.5W5pts.wt. diisocyanate compound under heating to react the component (A) with (D). The amount of the reaction product between the components (a) and (b) is preferably 20W60pts.wt. per 100pts.wt. the component (c) in the case of the weight ratio between the components (a) and (b) of 100:3W100:5.


Inventors:
ANDOU HIROMICHI
KAMEI EIJI
WAKABAYASHI ICHITAMI
Application Number:
JP14634879A
Publication Date:
June 11, 1981
Filing Date:
November 12, 1979
Export Citation:
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Assignee:
NOGAWA CHEMICAL KK
International Classes:
C09J175/00; C08L75/04; (IPC1-7): C08L75/04; C09J3/16
Domestic Patent References:
JPS50122534A1975-09-26