Title:
コバルト及び／又はコバルト合金含有の基板の研磨のための化学機械研磨（ＣＭＰ）組成物の使用
Document Type and Number:
Japanese Patent JP6720185
Kind Code:
B2
Abstract:
A chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) containing (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) contains: (A) Inorganic particles, (B) a substituted aromatic compound with at least one carboxylic acid function as corrosion inhibitor, (C) at least one amino acid, (D) at least one oxidizer, (E) an aqueous medium, wherein the CMP composition (Q) has a pH of from 7 to 10.
Inventors:
Reichart, Robert
Giebert, Max
Orchid, yonchin
Michael Lauter
Usman Ibrahim, Sheikh Ansar
Gorzanian, Reza
Gwenven, Hachi Osman
Prelus, Julian
Roy Nissen, Leonardus
Giebert, Max
Orchid, yonchin
Michael Lauter
Usman Ibrahim, Sheikh Ansar
Gorzanian, Reza
Gwenven, Hachi Osman
Prelus, Julian
Roy Nissen, Leonardus
Application Number:
JP2017533954A
Publication Date:
July 08, 2020
Filing Date:
December 22, 2015
Export Citation:
Assignee:
BASF SE
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
| JP2014229827A | ||||
| JP2013042123A | ||||
| JP2006093580A |
Foreign References:
| WO2014006546A2 |
Attorney, Agent or Firm:
Satoshi Eto