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Title:
USE OF FILM BASED ON PVDF, PMMA OR MIXTURE THEREOF FOR COVERING THERMOSETTING MATERIAL
Document Type and Number:
Japanese Patent JP3727633
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a use of a film based on PVDF (polyfluorinated vinylidene), PMMA (homopolymer of methyl methacrylate) or mixtures thereof for covering thermosetting resin materials.
SOLUTION: An adhesive layer comprises 0-60 pts.wt. of PVDF, 10-100 pts.wt. of PMMA having functional groups, 0-50 pts.wt. of an acrylic elastomer and 0-4 pts.wt. of UV absorber (total 100 pts.wt.), and a layer (A) comprises 100-0 pts.wt. of PMMA based on 0-100 pts.wt. of PVDF. A covered thermosetting product is obtained by cutting SMC (Sheet Molding Compound) comprising a support film, a crosslinkable composition (precursor of the thermosetting resin), the adhesive layer and the layer (A), releasing the support film, and setting the residue in a mold and then crosslinking to obtain the thermosetting resin product covered with the layer A.


Inventors:
Antony Bonnet
Philip Bushi
Dabi Shiragi
Application Number:
JP2003346435A
Publication Date:
December 14, 2005
Filing Date:
October 03, 2003
Export Citation:
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Assignee:
Arkema
International Classes:
B32B27/30; B32B27/08; C08J5/12; C09J7/22; C09J7/38; C09J11/06; C09J127/16; C09J133/00; C09J133/08; C09J133/12; C09J151/00; C09J151/06; (IPC1-7): C09J7/02; B32B27/30; C09J11/06; C09J127/16; C09J133/00; C09J133/12; C09J151/06
Domestic Patent References:
JP4218552A
JP10008008A
JP5220907A
Attorney, Agent or Firm:
Takashi Koshiba