To control the deposition rate accurately over a long time in vacuum deposition equipment.
Deposition equipment 1 includes an aperture adjustment mechanism adjusting the aperture of an opening 30 of a crucible 31, a crucible temperature adjustment mechanism adjusting the temperature of the crucible 31, a storage part 62 storing a predetermined threshold value of the aperture and deposition rate control part 6 controlling the aperture adjustment mechanism and the crucible adjustment mechanism to keep the deposition rate of a deposition material 32 to a target object 2 at a preliminarily inputted target deposition rate. The deposition rate control part 6 increases the temperature of the crucible 31 and decreases the aperture when the aperture of a valve 36 exceeds the threshold value of the aperture stored in the storage part 62. The control enables controlling the deposition rate for a long time by increasing the aperture of the valve 36 even when the deposition rate begins to decrease again. Since the deposition rate is controlled with an aperture equal to or lower than a threshold value of the aperture, the deposition rate can be controlled accurately.
WATANABE KENICHIRO
NISHIMORI TAISUKE
MIYAGAWA NOBUYUKI
Katsumi Taguchi
Shinichi Mizuta
Itaya Masayuki
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