To provide an optimal vacuum deposition method for precisely and stably forming a film with a predetermined film thickness by grasping a vaporizing state of a film-forming material while the film is formed by vacuum deposition and adjusting an vaporizing rate of the film-forming material on the basis of the grasped result, and to provide a vacuum deposition apparatus for conducting the vacuum deposition method.
The vacuum deposition method is directed at forming the film on a substrate by reducing a pressure inside a vacuum chamber, passing a current to an evaporation vessel for resistance-heating and accommodating the film-forming material to heat it, and comprises the steps of: keeping the control of heating for the evaporation vessel for a predetermined period of time (steps A to B) when resistance-heating the film-forming material so that the vaporizing rate of the film-forming material from the evaporation vessel becomes a predetermined value; and then, changing the heating condition for the evaporation vessel into a constant heating condition (steps C to D). The apparatus has a structure for realizing the method.
KASHIWATANI MAKOTO
Haruko Sanwa
Hiroshi Fukushima
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