Title:
VACUUM EVAPORATION SYSTEM FOR THIN FILM DEPOSITION
Document Type and Number:
Japanese Patent JP3671022
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To efficiently form films of two or more layers without taking out a substrate, on the surface of which the films have been formed on, from a vacuum chamber each time, therefore, without making the film contact with air and moisture, and to form the film only on the surface of the substrate without depositing by distributing molecules of a film-forming material in a vacuum chamber.
SOLUTION: The inside of the vacuum chamber 2 is divided in two or more vaporizing rooms 6 and 7 and a film-forming room 8 which is connected to these vaporizing rooms 6 and 7 through molecule passage windows 13 and 14. Molecular beam source cells 9 and 10 are arranged towards the molecule passage windows 13 and 14, respectively, in the above vaporizing rooms 6 and 7. A substrate 12 is arranged so that it may be movable between two or more molecule passage windows 13 and 14 in the above film-forming room 8, and also it may counter to the molecular beam source cells 9 and 10 at the positions of each molecule passage window 13 and 14.
Inventors:
Hiroshi Takahashi
Application Number:
JP2002110278A
Publication Date:
July 13, 2005
Filing Date:
April 12, 2002
Export Citation:
Assignee:
Eiko Engineering Co., Ltd.
International Classes:
C23C14/24; H01L51/50; H05B33/14; H05B33/10; (IPC1-7): H05B33/10; C23C14/24; H05B33/14
Domestic Patent References:
| JP2002080961A | ||||
| JP2001093667A |
Attorney, Agent or Firm:
Kazuyoshi Hojo