Title:
VACUUM MOLDING DIE STRUCTURE FOR FLAT CABLE AND VACUUM MOLDING METHOD OF THIS FLAT CABLE USING THE STRUCTURE
Document Type and Number:
Japanese Patent JP3741773
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide the vacuum molding die structure, which can form a flat cable at a different scale from each other without raising a cost, and to provide the manufacture thereof.
SOLUTION: This vacuum molding die has recesses 53, 55, in which a first insulating sheet and a flat circuit body and a second insulating sheet are arranged in this order, and multiple vacuum suction holes, which are opened in the peripheral edge of the recessed parts 53, 55 and which pinch the flat circuit body with both the insulating sheets for airtight adhesion with vacuum suction so as to form a flat cable. This vacuum forming die is formed of a main body block 43 and sub blocks 45, 47 to be arranged in an arrangement hole 49 of the main block for change.
Inventors:
Masashi Kitada
Application Number:
JP9837996A
Publication Date:
February 01, 2006
Filing Date:
April 19, 1996
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
B60R16/02; H01B13/00; (IPC1-7): H01B13/00; B60R16/02
Domestic Patent References:
| JP5314833A | ||||
| JP6223645A | ||||
| JP2174012A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Akira Kurihara
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu