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Patent Searching and Data


Title:
VACUUM MOLDING METHOD
Document Type and Number:
Japanese Patent JPS5775812
Kind Code:
A
Abstract:

PURPOSE: To mold a molded product with a recessed and protruded part by using a mold without a complicated recessed and protruded part by a method wherein a synthetic resin is coated to an upper and a back surfaces and pores of a metal plate having plural pores formed thereto and the resin coated metal plate is placed on a vacuum mold having a molding recessed part to mold said synthetic resin under a sucking and evacuating condition.

CONSTITUTION: A resin covered plate 4 is formed by coating a thermoplastic synthetic resin layer 3 over an upper and a back surfaces and an inside of pores 1 of a metal plate 2 having plural pores 1 drilled therein. Said resin coated plate 4 is heated to soften the synthetic resin layer 3 and a peripheral end part of the coated plate 4 is placed on a peripheral flange part of an opening of a molding recessed part 5 of a vacuum mold 6 and an inside of the molding recessed part 5 is sucked and evacuated. The synthetic resin layer 3 only at a part of the pore 1 not supported by the metal plate 2 is sucked into the molding recessed part 5 and deformed therein and a molded product with plural recessed and protruded parts 7 is obtained.


Inventors:
TERASONO MITSUO
Application Number:
JP15306880A
Publication Date:
May 12, 1982
Filing Date:
October 30, 1980
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B21D26/021; B21D26/031; B21D26/053; B21D26/059; B29C45/00; B29C51/00; B29C51/10; B29C51/14; (IPC1-7): B21D26/02; B29C17/04