To provide a vacuum package having superior airtightness and capable of enhancing mounting strength, along with a method of manufacturing the vacuum package, piezoelectric vibrator, oscillator, electronic apparatus, and radio-controlled timepiece.
A package 9 includes: a base substrate 2 and a lid substrate 3 which are bonded to each other; a cavity C which is formed between the base substrate 2 and the lid substrate 3, and in which a piezoelectric vibrating reed 4 can be sealed; and through electrodes 32 and 33 which penetrate the base substrate 2 in the thickness direction so as to provide electrical conduction between the inside and outside of the cavity C. Portions of the base substrate 2 and the lid substrate 3 around the cavity C form bonding regions in which the substrates 2 and 3 are bonded to each other. A notch 26, through which the bonding surface of the lid substrate 3 is exposed when seen from the thickness direction of the base substrate 2, is formed in each corner of the base substrate 2.
| JP2002124845A | 2002-04-26 | |||
| JP2009141581A | 2009-06-25 |
Noriaki Uchino
Nobuyuki Kimura