PURPOSE: To provide a vacuum processor in which a hydrogen-bonded protective film of a surface of a silicon wafer can be provided for a long time by blowing a small amount of hydrogen into a vacuum vessel.
CONSTITUTION: The vacuum processor comprises a vacuum vessel 1 for containing and conveying a wafer, a load locking chamber connected to the vessel to introduce or output the wafer to or from the vessel, and a vacuum processing chamber connected to the chamber 10 via a gate valve for vacuum- processing the wafer, and wherein the vessel 1 is formed of a vessel body 2 and a lower plate 3 for openably blocking a lower opening of the body 2, and the chamber 10 communicates with a hydrogen source 17. Hydrogen is blown into the body 3 in a state that the plate 3 is separated from the chamber 10.
SHINOZUKA SHUHEI
MATSUMURA MASAO
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