真空吸着パッドおよび基板保持装置

Title:

真空吸着パッドおよび基板保持装置

Document Type and Number:

Japanese Patent JP6914078

Kind Code:

B2

Abstract:

A vacuum suction pad capable of making it more difficult to separate a substrate when the substrate is held by vacuum suction, the vacuum suction pad 8 including: a pad main body 37 having a lower surface adhered to a stage 5 of a substrate holder 2; and a plurality of circular arc-shaped substrate holding convexities 38, provided on a top surface of the pad main body 37, for holding a substrate W attracted by vacuum suction to the top surface of the pad main body 37, wherein the substrate holding convexities 38 are arranged concentrically with the circular pad main body 37, and width W1 in a radial direction of the substrate holding convexity 38 located on a radially outer side among the plurality of substrate holding convexities 38 is narrower than width W2 in the radial direction of the substrate holding convexity 38 on a radially inner side.

Inventors:

Akira Yamamoto
Masayuki Nakanishi
Kenji Kodera

Application Number:

JP2017070755A

Publication Date:

August 04, 2021

Filing Date:

March 31, 2017

Export Citation:

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