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Title:
VACUUM VALVE
Document Type and Number:
Japanese Patent JP3663038
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a stable vacuum valve that is excellent in contact resistance and cut-off characteristics.
SOLUTION: The contact material of a vacuum valve comprises a high conductivity constituent cupper or the like and an arc resistant constituent consisting of Cr, in which particles having a diameter in the range of 1-150 μm occupy at least 90 vol.%, and the ratio of the difference between the thermal expansion coefficient α900 at 900°C, and the thermal expansion coefficient α50 at 50°C, to the thermal expansion coefficient α900 at 900°C of the contact material, [(α900-α50)×100/(α900)] should be not less than 0.8% and not more than 12%. Thereby, the formation of a groove produced in the interface between a Cr particle and a Cu matrix after undergoing a brazing process is suppressed so that the stabilization of the static withstand voltage, contact resistance and cutoff characteristics can be realized.


Inventors:
Isao Okutomi
Mitsutaka Homma
Seki Keisei
Atsushi Yamamoto
Takashi Kusano
Hiromichi Somei
Application Number:
JP23569997A
Publication Date:
June 22, 2005
Filing Date:
September 01, 1997
Export Citation:
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Assignee:
Shibafu Engineering Co., Ltd.
Toshiba Corporation
International Classes:
B22F3/00; C22C1/04; C22C5/06; C22C9/00; H01H1/02; H01H1/023; H01H1/025; (IPC1-7): H01H1/02; B22F3/00; C22C5/06; C22C9/00
Domestic Patent References:
JP9213153A
JP1258330A
JP58106721A
JP1272024A
JP3110724A
JP2177222A
Attorney, Agent or Firm:
Hidekazu Miyoshi