VAPOR DEPOSITION APPARATUS - FUTABA DENSHI KOGYO KK

Title:

VAPOR DEPOSITION APPARATUS

Document Type and Number:

Japanese Patent JP2008063590

Kind Code:

A

Abstract:

To provide a vapor deposition apparatus which has a simple electrode structure and uses plasma enabling consistent ionization of an evaporated material.

Thermoelectrons emitted from a filament 331 are applied to the vicinity of an exit of a nozzle 311 of a sealed evaporation source 31. Vapor 342 of an evaporation material (Cu) 34 injected into a vacuum chamber 32 from the nozzle 311 of the sealed evaporation source 31 is ionized in the vicinity of the exit of the nozzle 311 by the thermoelectrons emitted by the filament 331, which causes electron avalanche to generate a plasma state of inversed cone shape (flying shape of the evaporation material) 344. The plasma advances toward a substrate (a stainless plate) 333 and forms a deposition film of the deposition material (Cu).

More Like This:

JPH05106029	THIN FILM FORMING APPARATUS
WO/2000/046418	DEVICE FOR COATING SUBSTRATES WITH A VAPORIZED MATERIAL UNDER LOW PRESSURE OR IN A VACUUM USING A VAPORIZED MATERIAL SOURCE

Inventors:

NAKAMURA HIROKI
WATANABE HIROSHI

Application Number:

JP2005124315A

Publication Date:

March 21, 2008

Filing Date:

April 21, 2005

Export Citation:

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Assignee:

FUTABA DENSHI KOGYO KK
NAKAMURA HIROKI
WATANABE HIROSHI

International Classes:

C23C14/32; H05H1/24

Domestic Patent References:

JPH05106030A	1993-04-27
JPS61207572A	1986-09-13
JPS5527868A	1980-02-28
JP2003027222A	2003-01-29
JP2001011621A	2001-01-16

Attorney, Agent or Firm:

Masamitsu Ariga

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