PURPOSE: To form vapor deposition plating layers having stable quality and thicknesses by floating and disposing many pieces of sublimable materials on the molten bath surface of a material having the sp. gr. larger than the sp. gr. of these materials and irradiating these materials with electron beams, thereby heating and evaporating the materials.
CONSTITUTION: The plating raw materials 6a housed in an evaporation chamber 4 are irradiated with the electron beams 3 from an electron gun 2 in a vacuum or dilute gaseous atmosphere, by which the sublimable materials 6a are heated and evaporated and the sublimable material components are plated by vapor deposition on a continuously traveling material 1 to be plated. The molten bath consisting of the material having a low melting pt., low vapor pressure and the sp. gr. larger than the sp. gr. of the sublimable materials 6a is formed in the evaporation chamber 4 in the above-mentioned vapor deposition plating method. The many sublimable materials 6a which have an arbitrary shape and do not react with the molten bath forming material are floated, disposed and laid on the surface of the molten both. The sublimable materials 6a are scanned and irradiated in this state with the electron beams 3. As a result, the sublimable materials are uniformly evaporated and the stable evaporation speed are attained. The plating deposition is thus stabilized.
IWAI MASATOSHI
KAWAFUKU JIYUNJI
IRIE KOJI
AYABE HARUHIRO
KATO ATSUSHI
MIYAKE SHOJI
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