PURPOSE: To reduce the consumption of the liquid leaking to the external part by stopping the evaporation of the liquid caused with a high temp. state in short time, by providing the liquid cooling part which forcibly cools the liquid for forming a vapor phase together with the part to be heated.
CONSTITUTION: A cooling water is fed at soldering operation stoppage time by providing the cooling pipe 21 forcibly cooling a liquid 13 as well as providing the heater 14 as for the liquid heating part directly heating the liquid 13 at the inner part of the liquid tank part 12 of a vapor tank 11. The temp. of the liquid 13 is forcibly cooled rapidly upto below the temp. when the evaporation is stopped from the proper boiling point temp. by starting a forced cooling motion by feeding the cooling water to the cooling pipe 21 simultaneously with stopping a heating running by turning off the electrification to the heater 14, after completion of the work. In this way, the consumption of the liquid leaking out to the external part in a vapor form is reduced by stopping the evaporation of the liquid in a high temp. state of after stopping the heater.
| JPH0641023 | [Title of Invention] Reflo-Soldering Equipment |
| JPS62192260 | VAPOR PHASE TYPE SOLDERING DEVICE |
TAKAHASHI TAKAO
OKANO TERUO
Next Patent: VAPOR TYPE SOLDERING DEVICE