PURPOSE: To reduce an installation area and decrease the manufacturing cost of a device by providing a mechanism through which the supporting attachment of a substrate for treating where the substrate to be treated is placed is loaded and unloaded to and from respective reactors.
CONSTITUTION: Wafers are moved one by one by a moving mechanism 8 from wafer cassettes 6a-6d to wafer boats 3a and 3b that are held by a carrying mechanism 9. Further, several sheets of dummy wafers, for example, about three sheets of them are disposed at upper and lower parts of the wafer boats 3a and 3b. Although a plurality of wafers for treating, for example, about 25 sheets of them are disposed between the foregoing dummy wafers, the dummy wafers are left on the wafer boats 3a and 3b when continuous treatment is performed and then, only wafers for treating are loaded or unloaded. When moving is complete by the moving mechanism 8, the wafer boats 3a and 3b are carried on boat elevators 5a and 5b by the carrying mechanism 9 and the wafer boats are loaded into reactors 2a and 2b by means of the boat elevators 5a and 5b. After that, the treatment of semiconductor wafers 4, such as a silicon epitaxial growth, is performed by flowing a prescribed gas.
YOKOGAWA OSAMU
TANAKA DAISUKE
| JPS61144821A | 1986-07-02 |