Title:
SINGLE-SIDE POLISHING METHOD FOR WAFER
Document Type and Number:
Japanese Patent JPH06762
Kind Code:
A
Abstract:
PURPOSE: To flatly polish wafers and unify their thickness by utilizing the surface tension of an unhardened liquid such as water to stick two wafers.
CONSTITUTION: When wafers 3 of a semiconductor, a derivative, or glass are to be single-face polished with a both-face polishing device, two wafers 3 are dipped in an unhardened liquid 8 and stuck together in face contact, and the two wafers 3 stuck together via the surface tension are inserted into the both- face polishing device to polish both faces. The two wafers 3 are peeled off in a liquid of the same kind as the liquid 8. The two wafers 3 are uniformly polished, and the flatness of the wafers 3 after polishing can be improved.
Inventors:
KORENAGA JUNSUKE
Application Number:
JP18436392A
Publication Date:
January 11, 1994
Filing Date:
June 17, 1992
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
B24B37/04; B24B37/08; H01L21/304; (IPC1-7): B24B37/04; H01L21/304
Attorney, Agent or Firm:
Shigeki Kawase
Next Patent: POLISHING METHOD FOR SEMICONDUCTOR WAFER