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Patent Searching and Data


Title:
VIBRATION ANALYSIS SYSTEM
Document Type and Number:
Japanese Patent JPH09280943
Kind Code:
A
Abstract:

To provide a vibration analysis system which enables easily analyzing of vibration of a construction without depending on experience of a worker by realizing a connection between one set of nodes of a three-dimensional solid element by one set of spring models to enable utilization of rigidity information as intact per direction concerning the vibration analysis system in which a three-dimensional analysis model is generated to analyze vibration of the construction to be moved by a finite element analysis.

Three-dimentional solid elements 13 and 14 are generated for a construction 10 and a rail 2 to connect by a spring model 15 between nodes 13a and 14a contained in each one surface 16 and 17 of the three-dimensional solid elements 13 and 14 corresponding to a mounted surface 11 between the construction 10 and a connecting part 3 and a support surface 12 between the rail 2 and the connecting part 3. At the same time, the surfaces 16 and 17 are used as three-dimensional shell elements 16 and 17 to convert the connecting part 3 to a model and an LM guide 1 analyzes the vibration of the construction 10 mounted on the connecting part 3 to be linearly moved on the rail 2 by a finite element analysis.


Inventors:
SONODA TETSUYA
Application Number:
JP9371496A
Publication Date:
October 31, 1997
Filing Date:
April 16, 1996
Export Citation:
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Assignee:
RICOH KK
International Classes:
G01M99/00; G01H17/00; G05D19/02; G06F17/50; (IPC1-7): G01H17/00; G01M19/00; G06F17/50
Attorney, Agent or Firm:
有我 軍一郎