Title:
VISUAL INSPECTION METHOD FOR PACKAGED BOARD
Document Type and Number:
Japanese Patent JPH05302819
Kind Code:
A
Abstract:
PURPOSE:To obtain a visual inspection method for loaded base plate capable of inspecting the packaged state of the parts mounted on a printed board with high inspection accuracy and exactness. CONSTITUTION:A printed circuit board 1 packaged with parts 2 is scanned by a laser beam. The scattered light positive varying with the roughness on the packaged board is detected. From the position signals, the average of the region elevation of a submask 18 adjacent to the parts 2 on the printed board 1 is calculated and the average of the parts 2 elevation in the mask 17 region is calculated. A judged value obtained by adding a threshold value to the printed board 1 elevation in the submask 18 region is compared with the elevation of the parts 2 in the mask 17 region. As the printed board 1 elevation in the submask 18 region is calculated at each moment, good or bad judgment of packaged state of the parts is available without being affected by printed board bend, part displacement within a tolerable range and dimensional tolerance, etc.
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Inventors:
SETA JUNZO
TOBA HIROKADO
YASUDA AKIO
SEKITO TAKUMI
KOSEKI YOKO
KODAMA TOMOAKI
TOBA HIROKADO
YASUDA AKIO
SEKITO TAKUMI
KOSEKI YOKO
KODAMA TOMOAKI
Application Number:
JP10964492A
Publication Date:
November 16, 1993
Filing Date:
April 28, 1992
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
G01B11/24; G01N21/88; G01N21/956; G06T1/00; H05K13/08; (IPC1-7): G01B11/24; G06F15/62; H05K13/08
Attorney, Agent or Firm:
Akira Kobiji (2 outside)
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