Title:
Wafer and Reticle Inspection Methods and Systems Using Designer Intent Data
Document Type and Number:
Japanese Patent JP6306639
Kind Code:
B2
Abstract:
Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the water in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.
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Inventors:
Marella, Paul Frank
McCowley, Sharon
Chan, Ellis
Volk, william
Willie, james
Watson, sterling
Kekare, Sagar A
Hess, curl
McCowley, Sharon
Chan, Ellis
Volk, william
Willie, james
Watson, sterling
Kekare, Sagar A
Hess, curl
Application Number:
JP2016093234A
Publication Date:
April 04, 2018
Filing Date:
May 06, 2016
Export Citation:
Assignee:
KLA-Tenker Corporation
International Classes:
G03F1/84; G01N21/95; G03F1/44; G03F1/70; G03F7/20; H01L21/66
Domestic Patent References:
| JP2002532760A | ||||
| JP2000047369A | ||||
| JP2002323458A | ||||
| JP2002014459A | ||||
| JP2001033941A |
Attorney, Agent or Firm:
Shigeki Yamakawa
Masaki Yamakawa
Masaki Yamakawa