Title:
基板どうしの接合方法、基板接合装置
Document Type and Number:
Japanese Patent JP6448656
Kind Code:
B2
Abstract:
A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain. A method for bonding a first substrate and a second substrate includes a step of performing hydrophilization treatment to cause water or an OH containing substance to adhere to bonding surface of the first substrate and the bonding surface of the second substrate, a step of disposing the first substrate and the second substrate with the respective bonding surfaces facing each other, and bowing the first substrate in such a way that a central portion of the bonding surface protrudes toward the second substrate side relative to an outer circumferential portion of the bonding surface, a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate at the respective central portions, and a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate across the entirety of the bonding surfaces, decreasing a distance between the outer circumferential portion of the first substrate and an outer circumferential portion of the second substrate with the respective central portions abutting each other at a pressure that maintains a non-bonded condition,.
Inventors:
Akira Yamauchi
Application Number:
JP2016554151A
Publication Date:
January 09, 2019
Filing Date:
October 19, 2015
Export Citation:
Assignee:
Bond Tech Co., Ltd.
International Classes:
H01L21/02; B23K20/00; B23K20/24; H01L21/68; H01L21/683
Domestic Patent References:
| JP2008258426A | ||||
| JP2009043837A | ||||
| JP2014138136A | ||||
| JP2013120901A | ||||
| JP2013243333A | ||||
| JP2013258377A | ||||
| JP2011249643A | ||||
| JP2005142537A |
Foreign References:
| US7682933 | ||||
| US20140261960 | ||||
| WO2014156987A1 |
Attorney, Agent or Firm:
Kimura Mitsuru
Taiji Morikawa
Shiro Ryutake
Yasushi Sakakibara
Taiji Morikawa
Shiro Ryutake
Yasushi Sakakibara