Title:
ウエハーのブレイク方法並びにブレイク装置
Document Type and Number:
Japanese Patent JP7340838
Kind Code:
B2
Abstract:
The present invention provides a breaking method and a breaking device, which can reduce the formation of oblique breaks, nicks, etc. at the dicing surface and obtain high quality chips by maintaining a wafer in a stable situation during breaking. The present invention provides a method for breaking a wafer (W) fixated by attaching a substrate, where scribing lines (S1, S2) are processed on a single surface, by a dicing tape (2) made of a sticky resin. Before the wafer (W) is broken, the coating tape (3) made of sticky resin is attached to the opposite surface to the surface which the dicing tape is attached on the wafer, and the wafer (W) is clamped and fixated by the coating tape (3) and the dicing tape (2) from both of the top and bottom sides, and then the wafer (W) is warped by pressing a breaking bar (6) from the top of the scribing lines so as to break the wafer along the scribing lines.
Inventors:
Kenta Tamura
Masakazu Takeda
Katsunori Ichikawa
Masakazu Takeda
Katsunori Ichikawa
Application Number:
JP2019085341A
Publication Date:
September 08, 2023
Filing Date:
April 26, 2019
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
H01L21/301; B26F3/00; B28D5/00; B28D7/04; C03B33/033
Domestic Patent References:
| JP5074931A | ||||
| JP2013058671A | ||||
| JP2016040079A | ||||
| JP2016043505A | ||||
| JP11274653A |
Attorney, Agent or Firm:
Yoshio Kashima