Title:
ウェハ研削装置
Document Type and Number:
Japanese Patent JP6793767
Kind Code:
B2
Abstract:
To provide a wafer grinding device capable of smoothly and easily executing positioning of a grinding start position.SOLUTION: A wafer grinding device comprises: an arm 11 which is extended in a horizontal direction H; lifting/lowering means 12 for lifting and lowering the arm 11 in a vertical direction V; an upper contact sensor 13 which is disposed at an upper part of a tip of the arm 11 and detects contact with a grindstone 4; a lower contact sensor 14 which is disposed at a lower part of the tip of the arm 11 and detects contact with a wafer chuck 3; and control means which determines that a state in which the upper contact sensor 13 is in contact with the grindstone 4 and the lower contact sensor 14 is in contact with the wafer chuck 3 as a grinding start point of the grindstone 4.SELECTED DRAWING: Figure 3
Inventors:
Maeda Yuki
Application Number:
JP2019038067A
Publication Date:
December 02, 2020
Filing Date:
March 01, 2019
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B24B47/22; B24B7/00; B24B49/02; H01L21/304
Domestic Patent References:
| JP7276188A | ||||
| JP63038967U | ||||
| JP2013144327A | ||||
| JP62107935A |
Foreign References:
| US20170095902 |
Attorney, Agent or Firm:
Takamitsu Shimizu