To manufacture a wafer identical with a model shape at a high yield by controlling grinding conditions according to the wafer shape during the grinding thereof.
In this device, a shape of a wafer 1 is detected by a plurality of sensors s11-s13, s21-s23 being opposite to each face of the wafer 1 outside a fixed-ring-shaped surface plate 13 and a movable ring-shaped surface plate 23, with a deflection angle bearing 50 supporting a movable rotary shaft 11 when both faces of the wafer 1 are ground by the ring-shaped surface plates 13, 23 being pressed against the wafer 1 over an area from the center to the edge of each wafer 1 face. Either the result detected is computed by comparison with a model shape and then a deflection angle of a movable rotary shaft 21 is controlled according to the result computed. Otherwise, an outline of the wafer 1 is determined by a deflection angle θ of the movable rotary shaft 21, and the result determined is computed by comparison with the model shape and then the deflection angle θ of a movable rotary shaft 21 is controlled according to the result computed. Accordingly, since the deflection angle of the ring-shaped surface plate 23 to the wafer 1 is controlled during the grinding thereof, the wafer 1 is ground into the shape of the model with a high accuracy.
ISHIKAWA TOSHIBUMI
IIDA WATARU
OSAKA TETSUTSUGU
ISHIGURE HIROSHI
ABE MORITOSHI
TOYODA MACHINE WORKS LTD
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