Title:
WAFER GRINDING METHOD
Document Type and Number:
Japanese Patent JP2023030945
Kind Code:
A
Abstract:
To provide a grinding device for grinding a wafer while bringing a probe into contact with the wafer to measure a thickness of the wafer, which grinds the wafer into a predetermined finish thickness even under a grinding/processing condition under which more grinding chips are ejected.SOLUTION: A wafer grinding method comprises: setting a finishing thickness 72 and a confirming thickness 71 that is a thickness of a wafer before reaching the finishing thickness 72, in a grinding device; holding the wafer on a holding surface; grinding the wafer by holding the wafer on a holding surface and making a grinding stone approach the wafer while measuring the thickness of the wafer to grind the wafer; stopping the operation of making the grinding stone approach the holding surface when a measured value of the thickness of the wafer becomes equal to the confirming thickness 71, and measuring the thickness of the wafer for a predetermined time, with a lower surface of the grinding stone in contact with an upper surface of the wafer; and thereafter additionally grounding the wafer by a residual grinding amount determined by subtracting the thickness of the wafer measured for the predetermined time from the finishing thickness 72.SELECTED DRAWING: Figure 2
Inventors:
SAITO MASARU
NAGAI TAKESHI
YAMADA SHINYA
NAGAI TAKESHI
YAMADA SHINYA
Application Number:
JP2021136371A
Publication Date:
March 08, 2023
Filing Date:
August 24, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B7/04; B24B49/04; B24B49/10; H01L21/304
Attorney, Agent or Firm:
Patent Attorney Corporation Tokyo Alpa Patent Office
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