Title:
WAFER HOLDING DEVICE
Document Type and Number:
Japanese Patent JP2001105306
Kind Code:
A
Abstract:
To solve the problem of wafer edge thickness hunting due to press contact and protrusion phenomena which occur during the period of using a flat bottom-shaped wafer holding device.
B forming one or plural circular grooves 121 on the bottom face of a wafer holding ring 120 of a training housing for storing a wafer 30 on a polishing pad 40, the press contact and protrusion phenomena of the polishing pad 40, which are generated due to the pressure of the wafer holding ring 120, are cancelled to prevent the press contact and protrusion phenomena from being transmitted to the wafer edge.
Inventors:
BA SHOHAN
KIN MINKEI
KIN MINKEI
Application Number:
JP2000023718A
Publication Date:
April 17, 2001
Filing Date:
February 01, 2000
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD
International Classes:
B24B37/04; B24B37/30; H01L21/304; H01L21/68; H01L21/683; (IPC1-7): B24B37/04; H01L21/304
Attorney, Agent or Firm:
Hattori Masaki
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